| Mark | GB | JIS | ASTM | |||||||
| TU1、TU2、T2 | C1020、C1100 | C10200、C10300、C11000 | ||||||||
| Executive standard | GB/T 5187-2021、JISH3100、ASTMB152 | |||||||||
| Main Application | Thermal conductive and heat-dissipating copper foil assemblies for high-end electronic equipment including HVAC & refrigeration systems, electronic control modules, industrial machinery, AI liquid-cooled servers, vapor chambers and thermal cavities. | |||||||||
| Thickness range mm | Thickness | ≥0.03-0.05 | ≥0.05-0.07 | ≥0.07-0.1 | ||||||
| tolerance | ±0.002 | ±0.003 | ||||||||
| Width range mm | Width | 20-600(Custom) | ||||||||
| Tolerance | ±0.1 | |||||||||
| Temper | O60 | H04 | H06 | O60 | H04 | H06 | O60 | H04 | H06 | |
| Strength of extense MPa | ≥165 | ≥295 | ≥380 | ≥170 | ≥295 | ≥380 | ≥175 | ≥295 | ≥380 | |
| Ductility % | ≥10 | - | - | ≥15 | - | - | ≥16 | - | - | |
| Vickers hardness HV | GB | |||||||||
| Electric conductivity %IACS | GB | |||||||||

